PRODUCTS
KLA Zeta 3D Optical Imaging and Metrology System
KLA Zeta precision metrology systems that analyze high-roughness, low-reflectance surfaces for Biotech, solar cell, LED, MEMS and other micron-scale measurement applications. Our wide-field optical profilers can measure high-aspect-ratio features from the millimeter to sub-micron range, and film thicknesses down to 30nm. The bundled Zeta 3D imaging software produces true-color 3D feature maps in a fraction of the time of other surface profilers. With available Nomarski / Quantitative-DIC and Film Thickness Measurement options, our systems provide the widest range, highest flexibility and best value in its class.
Zeta's patented Z-DotTM technology enables researchers and production managers to create true-color, 3D images of sub-micron surface features for measurement applications in High-Brightness LEDs, Solar Cells, Biotech, and Magnetic Storage Media. The Z-Dots enable the system software to rapidly identify features within the plane of focus to create accurate 3D surface maps of Patterned Sapphire Substrates, Surface Textures, Microfluidic Channels, and Micro-machining defects.
MULTI MODE OPTICS TECHNOLOGY
KLA Zeta Optical Profiler integrates five powerful optical metrology technologies in one fully configurable and easy-to-use system.
It images and analyzes different size features on samples of all types: smooth to rough, very low to very high reflectivity, transparent to opaque, single layer to multilayer, sub-nm to mm. The versatility of the Zeta technology is simply unmatched by any other metrology tools.
METROLOGY
ZDot™
Zeta's proprietary 3D imaging technology combines innovative optics with powerful software algorithms to produce great results even for difficult surfaces
ZSI
Shearing interferometry for images with high z resolution
ZXI
Interferometer optics enables wide area measurements with a high Z resolution
ZFT
Integrated broad-band reflectometer for thin film thickness and surface reflectance measurements
ZIC
Interference contrast technique providing enhanced & quantitative images of sub-nanometer level roughness
AOI
Automated Optical Inspection option combines Metrology and Defect Inspection into one efficient, cost effective, and powerful system
Zeta-20 Optical Profiler
The Zeta-20 is a fully integrated optical profiling microscope that provides 3D metrology and imaging capability in a compact, robust package. The system is powered by ZDot™ technology, which simultaneously collects high-resolution 3D data and a True Color infinite focus image. The Zeta-20 supports both R&D and production environments with Multi-Mode optics, easy-to-use software, and a low cost of ownership.
Zeta-300 Optical Profiler
The Zeta-300 provides 3D metrology and imaging capability, combined with an integrated isolation table and configuration flexibility to handle larger samples. The system is powered by ZDot™ technology, which simultaneously collects high-resolution 3D data and a True Color infinite focus image. The Zeta-300 supports both R&D and production environments with Multi-Mode optics, easy-to-use software, and a low cost of ownership.
Zeta-388 Optical Profiler
The Zeta-388 provides 3D metrology and imaging capability, combined with an integrated isolation table and a cassette-to-cassette wafer handling system for fully automated measurements. The system is powered by ZDot™technology, which simultaneously collects high-resolution 3D data and a True Color infinite focus image. The Zeta-388 supports both R&D and production environments with Multi-Mode optics, easy-to-use software, a low cost of ownership, and SECS/GEM communications.
Zeta-5xx/6xx Advanced Packaging Metrology Systems
The Zeta-5xx Series optical profilers are fully automated 300mm wafer metrology systems capable of measuring a variety of applications such as bump height, RDL (redistribution layer) CD, UBM (under bump metallization) step height, film thickness and wafer bow, which are critical to process control in advanced wafer-level packaging. Multi-mode optics save time and reduce cost by enabling a wide variety of measurement types on the single system, while the resulting high resolution 3D images and analysis provide the data required to enable process feedback cycles to drive yield improvement.
For panel based wafer-level packaging applications, automated panel handling is available on the Zeta-6xx Series profilers, which offer the same metrology measurement capability as the 5xx Series.
APPLICATION
- Step height: 3D step height from nanometers to millimeters
- Texture: 3D roughness and waviness on smooth to very rough surfaces
- Form: 3D bow and shape
- Stress: 2D thin film stress
- Film thickness: transparent film thickness from 30nm to 100µm
- Seed layer metal reflectivity
- PI and PR film thickness
- PI and PR opening
- Plated Cu thickness
- UBM height and roughness
- RDL thickness, width and roughness
- TSV fill monitoring
- Bump height
- Bow and stress
INDUSTRIES
- LED: light emitting diodes and PSS (patterned sapphire substrates)
- Solar: photovoltaic solar cells
- Semiconductor and compound semiconductor
- Semiconductor WLCSP (wafer-level chip scale packaging)
- Semiconductor FOWLP (fan-out wafer-level packaging)
PCB (printed circuit board) and flexible PCB - MEMS: Micro-electro-mechanical systems
- Medical devices and microfluidic devices
- Data storage
- Universities, research labs and institutes
- And more: Contact us with your requirements